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ALPHA® Fortibond™

For LED Applications

The Fortibond™ technology was specifically designed for LED manufacturers that require pressureless sintering in their die attach process. It is based on Alpha’s proprietary pressure-less silver sintering technology consisting of highly engineered silver particles. Fortibond™ is compatible with existing printing, dispense and die-bonding equipment and can be sintered in conventional ovens. Fortibond™ provides high thermal and electrical conductivity silver bonds, high reliability and flexible yet controlled bond line thickness.

Features and benefits of Fortibond™ A Series
  • Pressure-less sintering compatible with existing dispense / printing equipment with sintering in box convection oven.

  • High bulk Thermal conductivity enabling lower LED junction temperature
  • High reliability - JEDEC MSL1, excellent thermal shock, thermal cycling and thermal aging performance for longer device lifetime
  • Robust printing and dispense stability enables flat and customizable bond line thickness
  • Regular refrigerator storage and shipping without dry ice for easy economical handling

 

AL12P

AL12D

Application Platform

Printable

Dispense

Sintering Temp

180°C - 200°C

 180°C - 200°C

Thermal Conductivity

135W/mK

130W/mK

Substrate

DBC, DPC, Cu MCPCB

Leadframe

Surface Finish Compatibility

Au, Ag

Au, Ag

Chip Structure “Recommendation”

Flip Chip on Board 

Vertical Chip in Package

Vertical Chip in Package


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