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OL107F Solder Paste
【 Solder Paste for fine pitch printing application 】

◆ FEATURES
Solder Paste OL107F is a solder paste whose flux system meets the requirements of fine pitch printing application.  ・ Stable viscosity realizes a long period of continuous printing (>24hours).   It reduces the waste of solder paste.  ・ The flux is applicable to paste in holes process. And the appearance of flux residues is clear.  ・ Also printability has been promoted due to its improved rolling property.  ・ Solubility has been promoted by using a unique activator system. It reduces the occurrence of solder ball, as well.                                                               

◆ APPLICATIONS

 OL107F is formulated for fine pitch stencil application. Tack life is over 24 hours, although it depends on the conditions. The following is an example of specification. Regarding metal content and viscosity, various specifications are available. Please contact us for further information on the different specification.    

 

 Application 

 Alloy Type (Nominal)

 Metal Content

 Powder Size

 Viscosity (Nominal )

Metal Mask Printing  

63Sn/37Pb 62Sn/36Pb/2Ag NT4S  

 90%

Type 3 Type 4

 

 200 Pa.s

 

 

기술자료
TB-Solder Paste-OL107F.pdf
환경자료
MSDS

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