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ALPHA¢ç OM340-SL  HIGH RELIABILITY LEAD-FREE SOLDER PASTE 
DESCRIPTION  
ALPHA OM340-SL is a lead-free, halogen free, no-clean solder paste designed for a broad range of applications. ALPHA OM340-SL¡¯s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste.  This material is engineered to deliver lead free solder with a very high level of electrical reliability. ALPHA OM340-SL yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability (11 mil Squares) and high ¡°throughput¡± applications. 
Outstanding reflow process window delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM340-SL is formulated to deliver excellent visual joint cosmetics. Additionally, ALPHA OM340-SL¡¯s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.  

FEATURES & BENEFITS  
 • Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 0.275mm  

   (0.011¡±) with 0.100mm (4mil) stencil thickness. 

 • Excellent print consistency with high process capability index across all board designs.  

 • Print speeds of up to 150mm/sec (6¡±/sec), enabling a fast print cycle time and a high throughput.

 • Wide reflow profile window with good solderability on various board / component finishes.

 • Excellent solder and flux cosmetics after reflow soldering 

 • Reduction in random solderballing levels, minimizing rework and increasing first time yield 

 • Meets highest IPC 7095 voiding performance classification of Class III. 

 • Excellent reliability properties, halide-free material 

 • Halogen free 

 • Compatible with either nitrogen or air reflow  
PRODUCT INFORMATION   
Alloys:   SAC305 (96.5%Sn/3.0%Ag/0.5%Cu)  

            SAC405 (95.5%Sn/4.0%Ag/0.5%Cu)  

            For other alloys, contact your local Cookson Electronics Sales Office.

Powder Size: Type 3, (25-45¥ìm per IPC J-STD-005)

Residues:    Approximately 5% by (w/w)

Packaging Sizes:     500 gram jars, 6¡± & 12¡± cartridges, DEK ProFlo TM cassettes, and 10cc and 30cc dispense syringes.

Flux Gel:                OM340-SL Flux Gel is available in 10cc and 30cc syringes for rework applications.

Lead Free:   Complies with RoHS Directive 2002/95/EC.  

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